| After-sales Service: | on-Site Installation, Commissioning and Training |
|---|---|
| Warranty: | 12 Months After Acceptance |
| Condition: | New |
| Certification: | CE, ISO 9001: 2015 |
| Automation: | Automatic |
| Suitable for: | Alloy, Sapphire, Quartz Crystal, Silicon, Magnets |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier
DA400 Multi-wire Saw
DA400 Multi-wire Saw is mainly designed for batch processing of Sapphire, Special Ceramics, Silicon Nitride and other super hard and brittle materials into straight sheets. The machine is designed with double work stations and can achieve the cutting of super hard and brittle materials with workpiece swinging to reduce cutting area.
>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Flexibility
Achieve the cutting of both thick and thin sheets with the flexible wire winding for 3 rollers and five rollers.
>Stability
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire web shaking.
>Safety Guarantee
The main operation door can be raised and lowered electrically with safety device.
>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.
>Wire break memory system.
| Detail | Parameter |
| Model | DA400 |
| Maximum work size | φ125x400mm |
|
Workbench quantity |
2 |
| Roller out diameter*Workable width | (φ165±10mm)x10x5 |
|
Wire diameter |
φ0.12-φ0.25mm |
| Wire spool storage | 40km(φ0.25mm) |
| Maximum running speed | 1200m/min |
| Travel of table | 245mm |
| Table swing | ±7° |
| Cutting method | Vertically downward movement |
| Cutting feed speed | 0.1-99.9mm/min |
| Cutting fluid | Water-based cutting fluid or cutting oil |
| Fluid storage | 800L |
| Fluid flow rate | 200L/min |
| Power supply | 380V±10% 50HZ |
| Power | 50Kw |
| Air supply | Adopting water-based cutting fluid, the air pressure is ≥0.35MPa. |
| Size L*W*H | 3150x1900x2920mm |
| Weight | 8000kg |
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.
Suppliers with verified business licenses
Audited Supplier 
){kind=link}
){kind=link}