• CX680C Diamond Wire Cutting Machine for Magnetic Materials
  • CX680C Diamond Wire Cutting Machine for Magnetic Materials
  • CX680C Diamond Wire Cutting Machine for Magnetic Materials
  • CX680C Diamond Wire Cutting Machine for Magnetic Materials
  • CX680C Diamond Wire Cutting Machine for Magnetic Materials
  • CX680C Diamond Wire Cutting Machine for Magnetic Materials

CX680C Diamond Wire Cutting Machine for Magnetic Materials

After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
Condition: New
Certification: CE, ISO 9001: 2015
Automation: Automatic
Suitable for: Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Customization:
Manufacturer/Factory

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Shandong, China
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  • Overview
  • Product Description
  • Product Features
  • Product Parameters
  • Cut Samples
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
CX680C
Maximum Worksize
160X680X160mm
Maximum Running Speed
1200m/Min
Workbench Quantity
2
Roller out Diameter
155X155X690mm
Roller Quantity
4
Wire Diameter
0.12-0.25mm
Travel of Worktable Lifting
245mm
Cutting Method
Vertically Upward Movement
Cutting Fluid
Water-Based Cutting Fluid or Cutting Oil
Fluid Storage
800L
Fluid Flow Rate
200L/Min
Air Supply
More Than 0.4MPa
Dimension
2950X1920X2500mm
Weight
6000kg
Test Cut
Provide Test Cut Service
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description


CX680C Multi-wire Saw

CX680 Multi-wire Saw is mainly used for straight slicing of Rare Earth Permanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. The machine adopts four rollers direct drive + roller rotation adjustment structure, which can achieve the cutting of products within 30mm.

 

Product Features

 

>Double Worktable
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Whole-casted Frame
The whole casting structure has high damping coefficient and excellent vibration damping performance.
>Stable Wire Web Control
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire net shaking.
>Save Labor and Time
The roller auxiliary disassembly bracket can effectively reduce the labor intensity and disassembly time.

>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.
>Safety Guarantee
The main operation door can be raised and lowered electrically with safety device.
>Wire break memory system.

CX680C Diamond Wire Cutting Machine for Magnetic Materials
 

Product Parameters

Detail Parameter
Model CX680C
Maximum work size 160×680×160mm
Workbench quantity 2
Roller out diameter*Workable width (φ155±10mm)x690x4
Wire Diameter φ0.12mm-φ0.25mm
Wire spool storage 40km(φ0.25mm)
Maximum running speed 1200m/min
Travel of worktable lifting 245mm
Cutting method Vertically upward movement
Cutting feed speed 0.1-99.9mm/min
Cutting fluid Water-based cutting fluid or cutting oil
Fluid storage 800L
Fluid flow rate 200L/min
Power supply 380V±10%  50Hz
Power 41Kw
Air supply Adopting water-based cutting fluid, the air pressure is ≥0.4MPa.
Size L*W*H 2950*1920*2500mm
Weight 6000Kg

Cut Samples

CX680C Diamond Wire Cutting Machine for Magnetic Materials
CX680C Diamond Wire Cutting Machine for Magnetic Materials
 
CX680C Diamond Wire Cutting Machine for Magnetic Materials
CX680C Diamond Wire Cutting Machine for Magnetic Materials

 

 

About Us

CX680C Diamond Wire Cutting Machine for Magnetic Materials

CX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic MaterialsCX680C Diamond Wire Cutting Machine for Magnetic Materials

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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