Multi Wire Cutting Machine CF680H for Monocrystal Silicon

Product Details
Customization: Available
After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
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  • Multi Wire Cutting Machine CF680H for Monocrystal Silicon
  • Multi Wire Cutting Machine CF680H for Monocrystal Silicon
  • Multi Wire Cutting Machine CF680H for Monocrystal Silicon
  • Multi Wire Cutting Machine CF680H for Monocrystal Silicon
  • Multi Wire Cutting Machine CF680H for Monocrystal Silicon
  • Multi Wire Cutting Machine CF680H for Monocrystal Silicon
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  • Overview
  • Product Description
  • Product Features
  • Cut Samples
  • Product Parameters
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
CF680H
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
160X680X160mm
Maximum Running Speed
2400m/Min
Test Cut
Provide Test Cut Service
Dimension
3330X2220X2550mm
Weight
9500kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description

Multi Wire Cutting Machine CF680H for Monocrystal Silicon
CF680H Multi-wire Saw

CF680 Multi-wire Saw is mainly used for street slicing of Rare Earth Premanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. The machine adopts whole casting structure, equipped with double stations and four rollers direct drive structure, having the advantages of high wire speed, high efficiency and high accuracy.

 

Product Features

 

>High Cutting Efficiency
The machine adopts double station design and is able to cut two plates materials at the same time, which greatly improves the working efficiency.
>Whole-casted Frame
The whole casting structure has high damping coefficient and excellent vibration damping performance.
>Stability

The stable base provides the basic conditions for the application of high wire speed, fine wire and tolerance requirements.
>Optimized Pulley System
6 pulleys design can reduce diamond wire torsion and tension fluctuation. It can reduce wire breakage rate and improve cutting accuracy.
>Light Pulley Design
Using light pulley to reduce the moment of inertia, reduce the torsion and tension fluctuation of diamond wire, and meet the service conditions of high wire speed and fine wire.
>Easy Wire Winding
The wire pay-off wheel adopts the standard universal spool (PV600 reinforced I-wheel), and it's no need to rewind.
>Stable Wire Web Control
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire web shaking.

Multi Wire Cutting Machine CF680H for Monocrystal Silicon
 

Cut Samples

Multi Wire Cutting Machine CF680H for Monocrystal Silicon
Multi Wire Cutting Machine CF680H for Monocrystal Silicon
 
Multi Wire Cutting Machine CF680H for Monocrystal Silicon
Multi Wire Cutting Machine CF680H for Monocrystal Silicon

 

Product Parameters

 
Detail Parameter
Model CF680H
Maximum work size 160x680x160mm
Workbench quantity 2
Roller out diameter *Workable width (Φ170±10)*690mm*4 rollers
Wire diameter φ0.10mm-φ0.25mm
Wire spool storage 40km(φ0.20mm)
Maximum running speed 2400m/min
Travel of table 245mm
Cutting method Vertically upward movement
Cutting feed speed 0.1-99.9mm/min
Fast feed speed 250mm/min
Cutting fluid Water-based cutting fluid or cutting oil
Fluid storage 800L
Fluid flow rate 200L/min
Power supply Three-phase 380V 50Hz
Power 100Kw
Air supply Adopting water-based cutting fluid, the air pressure≥0.4 MPa.
Size L*W*H 3330mm*2220mm*2550mm
Weight 9500Kg

About Us

Multi Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal SiliconMulti Wire Cutting Machine CF680H for Monocrystal Silicon

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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