• Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
  • Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
  • Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
  • Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
  • Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
  • Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal

Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal

After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
Condition: New
Certification: CE, ISO 9001: 2015
Automation: Automatic
Suitable for: Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Customization:
Manufacturer/Factory

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Shandong, China
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  • Overview
  • Product Description
  • Product Features
  • Cut Samples
  • Product Parameters
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
CA400
Maximum Worksize
125X125X260mm
Maximum Running Speed
900m/Min
Test Cut
Provide Test Cut Service
Dimension
3100X1490X2360mm
Weight
4000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description

Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
CA400 Multi-wire Saw

 

CA400 Multi-wire Saw is designed to meet customers' demands for batch processing of Sapphire, Quartz Crystal, Special Ceramics, Silicon Nitride and other super hard and brittle materials into straight sheets. The machine can reduce the cutting area through workpiece swing to improve cutting speed. Show economy and practicality while ensuring processing efficiency, operational stability and process applicability.

 

Product Features

 

>Easy Installation
The rollers adopt double-cone positioned structure for convenient installation and disassembly.
>Optimized Pulley Design
8 pulleys design can reduce wire breakage rate and achieve convenient wire winding.
>Swing Cutting
Stronger cutting force with swing cutting.
>Underside Workbench
Underside workbench for convenient operation.
>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.
>Wire Break Memory System

 

 

Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
 

Cut Samples

Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
 
Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal
Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal

 

Product Parameters

Detail Parameter
Model CA400
Maximum work size φ125x260mm
Workbench qty 1
Roller out diameter *Workable width (φ145±10mm)*266mm*3
Wire diameter φ0.12mm-φ0.25mm
Wire Spool Storage 20km(φ0.25mm)
Maximum running speed 900m/min
Travel of workbench lifting 30mm
Workbench swing ±7°
Cutting method Vertically upward movement
Cutting feed speed 0.1-99.9mm/min
Cutting fluid Water--based cutting fluid or cutting Oil
Fluid storage 220L
Fluid flow rate 200L/min
Power Supply Three-phase 380V 50Hz
Rated power 30kw
Air supply Adopting water-based cutting fluid, the air pressure is ≥ 0.35MPa.
SizeL*W*H 3100mm*1490mm*2360mm
Weight 4000Kg

About Us

Diamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz CrystalDiamond Multi-Wire Saw CA400 for Slicing Sapphire Quartz Crystal

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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