• Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
  • Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
  • Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
  • Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
  • Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
  • Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers

Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers

After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
Condition: New
Certification: CE, ISO 9001: 2015
Automation: Automatic
Suitable for: Aluminum, Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Customization:
Manufacturer/Factory

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Shandong, China
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  • Overview
  • Product Description
  • Product Features
  • Cut Samples
  • Product Parameters
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
DA600
Maximum Worksize
205X205X600mm
Maximum Running Speed
2400m/Min
Test Cut
Provide Test Cut Service
Dimension
4300X1650X3300mm
Weight
13000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description

Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
DA600 Multi-wire Saw


This series is mainly used for high-precision cutting of silicon carbide crystals, with advantages of large loading capacity and high wire speed ensuring high precision and high reliability, and achieving a significant increase in production capacity.

It can cut materials in 4~8 inches, the cutting size is flexible according to customers' requirements.
 

Product Features

 

>Processing Size
3 wire guide rollers, the maximum processing size can be 8 inches.
>Flexibility
The cutting wire can be flexibly change between slurry and diamond wire to meet different requirements from customers.

>Stability

The take-up and pay-off spools are under the cutting room, it's more stable during machine running.

>High-speed Cutting
The machine is equipped with an upside-down swing cutting structure, which facilitates high-speed sheet cutting.

>Stable Wire Arrangement System
Better design of the guide wheel distance and high-precision detection of wire arrangement, reduce the risk of wire breakage.

>Advanced Tension System
More advanced tension control algorithm and high precision tension sensor.

Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
 

Cut Samples

Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
 
Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers
Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers

 

Product Parameters

Detail Parameter
Model DA600
Maximum work size φ205x600mm

Workbench quantity

1
Roller out diameter*Workable width (φ200±10mm)x610x3

Wire diameter

φ0.10-φ0.25mm
Wire spool storage 40km(φ0.25mm)
Maximum running speed 2400m/min
Travel of table 300mm
Table swing ±10°
Cutting method Vertically downward movement
Cutting feed speed 0.1-99.9mm/min
Tension range 5-50N
Tension system accuracy(during cutting) ±0.5N
Cutting fluid Water-based cutting fluid
Fluid storage 420L
Fluid flow rate 12000L/H
Power supply 380V±10%  50HZ
Power 120Kw
Air supply ≥0.4MPa
Size L*W*H 4300x1650x3300mm
Weight 13000kg

 

About Us

Multi-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon WafersMulti-Wire Saw Diamond Wire Cutting Machine for Sapphire Silicon Wafers

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.


 

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