| Customization: | Available |
|---|---|
| After-sales Service: | on-Site Installation, Commissioning and Training |
| Warranty: | 12 Months After Acceptance |
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DA300 Multi-wire Saw
This series is mainly used for high-precision cutting of silicon carbide crystals, with advantages of large loading capacity and high wire speed ensuring high precision and high reliability, and achieving a significant increase in production capacity.
It can cut materials in 4~8 inches, the cutting size is flexible according to customers' requirements.
>Processing Size
3 wire guide rollers, the maximum processing size can be 8 inches.
>Flexibility
The cutting wire can be flexibly change between slurry and diamond wire to meet different requirements from customers.
>Stability
The take-up and pay-off spools are under the cutting room, it's more stable during machine running.
>High-speed Cutting
The machine is equipped with an upside-down swing cutting structure, which facilitates high-speed sheet cutting.
>Stable Wire Arrangement System
Better design of the guide wheel distance and high-precision detection of wire arrangement, reduce the risk of wire breakage.
>Advanced Tension System
More advanced tension control algorithm and high precision tension sensor.
| Detail | Parameter |
| Model | DA300 |
| Maximum work size | φ205x300mm |
|
Workbench quantity |
1 |
| Roller out diameter*Workable width | (φ200±10mm)310x3 |
|
Wire diameter |
φ0.10-φ0.25mm |
| Wire spool storage | 40km(φ0.25mm) |
| Maximum running speed | 2400m/min |
| Travel of table | 300mm |
| Table swing | ±10° |
| Cutting method | Vertically downward movement |
| Cutting feed speed | 0.1-99.9mm/min |
| Tension range | 5-50N |
| Tension system accuracy(during cutting) | ±0.5N |
| Cutting fluid | Water-based cutting fluid |
| Fluid storage | 420L |
| Fluid flow rate | 12000L/H |
| Power supply | 380V±10% 50HZ |
| Power | 120Kw |
| Air supply | ≥0.4MPa |
| Size L*W*H | 4000x1600x3200mm |
| Weight | 12000kg |
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.
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