CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon

Product Details
Customization: Available
After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
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  • CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
  • CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
  • CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
  • CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
  • CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
  • CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
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  • Overview
  • Product Description
  • Product Features
  • Product Parameters
  • Cut Samples
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
CF2260
Condition
New
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
220X600X180mm
Workbench Quantity
1
Roller Quantity
3
Wire Daimeter
0.12-0.25mm
Maximum Running Speed
1500m/Min
Travel of Table
255mm
Cutting Method
Vertically Upward Movement
Cutting Feed Speed
0.1-99.9mm/Min
Cutting Fluid
Water-Based Cutting Fluid or Cutting Oil
Fluid Storage
800L
Fluid Flow Rate
200L/Min
Power
40kw
Dimension
3400X2200X2700mm
Weight
7500kg
Test Cut
Provide Test Cut Service
Transport Package
Wooden Case
Specification
White
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description


CF2260 Multi-wire Saw

CF2260 Multi-wire Saw is a straight cutting equipment integrating the characteristics of previous mature models and is designed based on improving production efficiency and stability. The equipment is suitable for straight slicing of Rare Earth Permanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. It is suitable for the cutting of products within 0.5-15mm thickness. It has the characteristics of high processing efficiency, strong running stability and wide process applicability.

 

Product Features

 

>Stable Wire Web Control
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire web shaking.
>Optimized Pulley System
8 pulleys design can reduce diamond wire torsion, tension fluctuation and wire breakage rate.
>Easy Wire Winding
The wire pay-off wheel adopts the standard universal spool (PV600 reinforced I-wheel), and it's no need to rewind.
>Safety Guarantee
The main operation door can be raised and lowered electrically with safety device.
>Wire break memory system.

>Easy Operation
The cutting room is open on 3 sides for easier operation and maintenance.

 

CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon

Product Parameters

Detail Parameter
Model CF2260
Maximum work size 220mm×600mm×180mm
Roller out diameter *Workable width (φ180mm±10)x610mmx3
Wire Diameter φ0.12mm-φ0.25mm
Wire spool storage 40km(φ0.25mm)
Maximum running speed Max1500m/min
Travel of table Max255mm
Cutting method Vertically upward movement
Cutting feed speed 0.1-99.9mm/min
Cutting Fluid Water-based cutting fluid or cutting oil
Fluid Storage 800L
Fluid flow rate 200L/min
Power supply Three-phase 380V 50Hz
Power 40kw
Air supply More than 0.4MPa
Size L*W*H 3400mm*2200mm*2700mm
Weight 7500Kg

 

Cut Samples

CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
 
CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon
CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon

 

 

About Us

CF2260 Diamond Wire Saw for Cutting Monocrystal Silicon

CF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal SiliconCF2260 Diamond Wire Saw for Cutting Monocrystal Silicon

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.

2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.

3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.

4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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