Diamond Wire Saw Cutting Machine CX2121 for Optical Glass

• After-sales Service: on-Site Installation, Commissioning and Training
• Warranty: 12 Months After Acceptance
• Condition: New
• Certification: CE, ISO 9001: 2015
• Automation: Automatic
• Suitable for: Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
• Model NO.: CX2121
• Maximum Worksize: 204X210X210mm
• Maximum Running Speed: 1200m/Min
• Test Cut: Provide Test Cut Service
• Dimension: 2200X1900X2400mm
• Weight: 3000kg
• Transport Package: Wooden Case
• Trademark: LiKai
• Origin: China
• HS Code: 8464109000
• Production Capacity: 350sets/Year

Product Description

Product Description

CX2121 Multi-wire Saw
 

CX2121 Multi-wire Saw is designed with double-workbench to meet the demand for batch processing of super-hard materials such as Sapphire, Quartz Crystal, Optical Glass, Special Ceramics, Metal Composite/Alloys into straight sheets.
Five wire guide rollers design is mainly used to cut straight sheets of 5mm-60mm thickness.

 

Product Features

 

>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.

>Flexible Roller System
Achieve the cutting of products within 5-60mm thickness with the flexible wire winding for 3 rollers and five rollers.

>Easy Operation
Roller cutting system, workbench, tension system, take-up and pay-off and wire winding system are set in a plane for easy operation.
>Optimized Pulley Design
6 pulleys design can reduce wire breakage rate and achieve convenient wire winding.
>Flexible Cutting
The left and right slide table on the workbench can be independently moved back and forth, and the left and right sides can cut products of different thicknesses.
>Convenient Insttallation and Removal
The rollers are fastened with screws and equipped with special electric wrench for convenient disassembling and installation.
>Swing Cutting Function
Adding swing function to workbench to achieve the opening square cutting of semiconductor silicon carbide.
>Wire break memory system.

 

 

 

Cut Samples

 

 

Product Parameters

Detail	Parameter
Model	CX2121
Maximum work size	204x210x210mm
Slice thickness	5-60mm(wire winding number:≤40)
Workbench quantity	2
Roller out diameter *Workable width	(φ160-185mm)x210x5
Wire diameter	φ0.20-φ0.37
Wire spool storage	20km(φ0.25mm)
Maximum running speed	1200m/min
Travel of worktable lifting	240mm
Travel of worktable translation	100mm
Worktable swing angel	0
Cutting method	Vertically upward movement
Cutting feed speed	0.1~99.9mm/min
Cutting fluid	Water-based cutting fluid or cutting oil
Fluid storage	800L
Fluid flow rate	200L/min
Power supply	380V±10%  50HZ
Power	22Kw
Size L*W*H	2200x1900x2400mm
Weight	3000kg

About Us

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    ±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.