Diamond Single-Wire Sawing Machine for Large Size Sapphire Silicon Cutting Tool

• After-sales Service: on-Site Installation, Commissioning and Training
• Warranty: 12 Months After Acceptance
• Condition: New
• Certification: CE, ISO 9001: 2015
• Automation: Automatic
• Suitable for: Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
• Model NO.: DCX1000
• Maximum Worksize: 1000X1000X1000mm
• Maximum Running Speed: 1200m/Min
• Test Cut: Provide Test Cut Service
• Dimension: 3470X3500X3200mm
• Weight: 12000kg
• Transport Package: Wooden Case
• Trademark: LiKai
• Origin: China
• HS Code: 8464109000
• Production Capacity: 350sets/Year

Product Description

Product Description

DCX800 Single-wire Saw
 

DCX800 Single-wire Saw uses single diamond wire to cut super hard and brittle materials such as large size Sapphire, Quartz Crystal, Optical Glass, Jade, etc. With swing cutting function, through the diamond wire swing thus reduce the product cutting area and achieve the cutting of super hard and brittle materials.

 

Product Features

 

>Stable Frame
The machine body is whole-casted, which makes high speed running stable and reliable.

>Flexible Cutting
Horizontal displacement worktable makes cutting flexible and efficient.

>High Efficiency
Set swing cutting function for diamond wire for high efficiency.

>Cut Large Size Materials
Suitable for cutting large size workpiece, the maximum cutting size is up to 800x800x800mm.

>Wire break memory system.

 

 

 

Cut Samples

 

 

Product Parameters

Detail	Parameter
Model	DCX1000
Maximum work size	1000mm*1000mm*1000mm
Number of workbench	1
Storage	40Km
Running Speed	Max1200m/min
Wire diamond	φ0.25mm~φ0.6mm
Cutting method	Diamond wire feeds parallel or swinging downwards
Workbench swing angle	±30°
Cutting fluid	Water-based cutting fluid or cutting oil
Fluid storage	355L
Fluid flow rate	180L/min
Power	Three-phase 380V 50Hz
Full-load Power	25kw
Size L*W*H	3470mm*3500mm*3200mm
Weight	12000Kg

 

About Us

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    ±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.