CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool

Product Details
Customization: Available
After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
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  • CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
  • CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
  • CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
  • CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
  • CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
  • CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
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  • Overview
  • Product Description
  • Product Features
  • Product Parameters
  • Cut Samples
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
CX120A
Maximum Worksize
160X160X690mm
Maximum Running Speed
1000m/Min
Material Plate Quantity
4
Workbench Quantity
2
Roller out Diameter
130X130X150mm
Roller Quantity
3
Wire Diameter
0.12-0.25mm
Wire Spool Storage
40km
Travel of Worktable Lifting
220mm
Travel of Worktable Translation
200mm
Cutting Method
Vertically Upward Movement
Cutting Fluid
Water-Based Cutting Fluid or Cutting Oil
Dimension
4000X1900X2600mm
Weight
8500kg
Test Cut
Provide Test Cut Service
Transport Package
Wooden Case
Specification
White
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description


CX120A Multi-wire Saw
 

CX120A Multi-wire Saw is mainly applied to straight slicing of Rare Earth Permanent Magnet, Quartz Crystal, Optical Glass, Precious Metal and other hard and brittle materials. The unique design can achieve the replacement of internal circle cutter.

 

Product Features

 

>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Stable Frame
The whole casting structure has high damping coefficient and excellent vibration damping performance.
>Optimized Location System
The rollers and wire spools adopt cone-positioned structure with high accuracy and high rigidity to control wire web shaking.
>Flexible Cutting
The left and right slide table on the workbench can be independently moved back and forth, and the left and right sides can cut products of different thicknesses.
>Flexible Wire Winding
Achieve the cutting of products within 170mm through switching wire winding mode.
>Convenient Wire Winding
The wire pay-off spool adopts the standard universal spool (PV600 reinforced I-wheel), and it's no need to rewind.
>Wire break memory system.

 

 

CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
 

Product Parameters

Detail Parameter
Model CX120A
Maximum work size 160×690mm(Double workbench)
Material plate qty 4
Workbench qty 2
Wire winding space 85/170mm
Wire winding workbench qty 16/14
Roller out diameter *Workable width (φ130±10mm)x15x3rollers
Wire diameter φ0.12mm-φ0.25mm
Wire spool storage 40km(φ0.25mm)
Maximum running speed Max 1000m/min
Travel of table lifting 220mm
Travel of table translation 200mm
Cutting method Vertically upward movement
Wire feed speed 0.1~99.9mm/min
Cutting Fluid Water-based cutting fluid or cutting oil
Fluid Storage 800L
Fluid Flow rate 200*2L/min
Power supply Three-phase 380V 50Hz
Power 26Kw
Air supply Adopting water-based cutting fluid, the air pressure is more than 0.4MPa.
Size L*W*H 4000mm*1900mm*2600mm
Weight 8500Kg

Cut Samples

CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
 
CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool
CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool

 

 

About Us

CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool

CX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing ToolCX120A Diamond Multi-Wire Saw Cutting Equipment for Magnets Sapphire Processing Tool

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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