Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool

Product Details
Customization: Available
After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
Diamond Member Since 2024

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  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
  • Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
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  • Overview
  • Product Description
  • Product Features
  • Cut Samples
  • Product Parameters
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
CA4040
Condition
New
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
400X250X400mm
Maximum Running Speed
1000m/Min
Test Cut
Provide Test Cut Service
Dimension
3000X2200X2820mm
Weight
5000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description

Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
CA4040 Multi-wire Saw

 

CA4040 Multi-wire Saw is mainly used for batch opening square of super hard and brittle materials such as Sapphire, Special Ceramics, Silicon Nitride, etc. into straight sheets. The machine can achieve cutting of super hard and brittle materials through workpiece swing to reduce cutting area. Five rollers design enables the machine to cut products within range of 5-60mm thickness.

 

Product Features

 

>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Easy Operation
Roller cutting system, workbench, tension system, take-up and pay-off and wire winding system are set in a plane for easy operation.
>Swing Cutting
The cutting force is stronger with the worktable swing design. Double worktable has an independent servo control system and can run independently.
>Flexible Wire Winding Mode
The rollers quantity can be flexibly changed between 3 and 5 to achieve cutting for products in different sizes.
>Stable Running
Five-roller direct drive structure leads to stable operation of the equipment.
>Wire Break Memory System

 

 

Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
 

Cut Samples

Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
 
Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool
Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool

 

Product Parameters

Detail Parameter
Model CA4040
Maximum work size 400x250x400mm
Slice thickness 5-60mm(wire winding number ≤50)
Workbench qty 2
Roller out diameter *Workable width (φ180±10mm)*260mm*5
Wire diameter φ0.20mm-φ0.37mm
Wire Spool Storage 40km(φ0.25mm)
Maximum running speed 1000m/min
Travel of workbench lifting 422mm
Workbench swing ±7.5°
Cutting method Vertically upward movement
Cutting feed speed 0.1-99.9mm/min
Cutting fluid Water--based cutting fluid or cutting Oil
Fluid storage 800L
Fluid flow rate 200L/min
Power Supply Three-phase 380V 50Hz
Rated power 42kw
Air supply ≥ 0.4MPa.
SizeL*W*H 3000mm*2200mm*2820mm
Weight 5000Kg

About Us

Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing ToolDiamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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