DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide

Product Details
Customization: Available
After-sales Service: on-Site Installation, Commissioning and Training
Warranty: 12 Months After Acceptance
Diamond Member Since 2024

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Importers and Exporters
The supplier has import and export rights
High Repeat Buyers Choice
More than 50% of buyers repeatedly choose the supplier
R&D Capabilities
The supplier has 24 R&D engineers, you can check the Audit Report for more information
Management Certification
The supplier has quality management system certification, including:
ISO9001:2015 certificate
ISO45001:2018 certificate
ISO14001
to see all verified strength labels (26)
  • DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
  • DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
  • DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
  • DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
  • DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
  • DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
Find Similar Products
  • Overview
  • Product Description
  • Product Features
  • Cut Samples
  • Product Parameters
  • About Us
  • FAQ
Overview

Basic Info.

Model NO.
DCX1000
Condition
New
Certification
CE, ISO 9001: 2015
Automation
Automatic
Suitable for
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
Maximum Worksize
1000X1000X1000mm
Maximum Running Speed
1200m/Min
Test Cut
Provide Test Cut Service
Dimension
3470X3500X3200mm
Weight
12000kg
Transport Package
Wooden Case
Trademark
LiKai
Origin
China
HS Code
8464109000
Production Capacity
350sets/Year

Product Description

Product Description

DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
DCX800 Single-wire Saw

 

DCX800 Single-wire Saw uses single diamond wire to cut super hard and brittle materials such as large size Sapphire, Quartz Crystal, Optical Glass, Jade, etc. With swing cutting function, through the diamond wire swing thus reduce the product cutting area and achieve the cutting of super hard and brittle materials.

 

Product Features

 

>Stable Frame
The machine body is whole-casted, which makes high speed running stable and reliable.

>Flexible Cutting
Horizontal displacement worktable makes cutting flexible and efficient.

>High Efficiency
Set swing cutting function for diamond wire for high efficiency.

>Cut Large Size Materials
Suitable for cutting large size workpiece, the maximum cutting size is up to 800x800x800mm.

>Wire break memory system.

 

 

DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
 

Cut Samples

DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
 
DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide
DCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide

 

Product Parameters

Detail Parameter
Model DCX1000
Maximum work size 1000mm*1000mm*1000mm
Number of workbench 1
Storage 40Km
Running Speed Max1200m/min
Wire diamond φ0.25mm~φ0.6mm
Cutting method Diamond wire feeds parallel or swinging downwards
Workbench swing angle ±30°
Cutting fluid Water-based cutting fluid or cutting oil
Fluid storage 355L
Fluid flow rate 180L/min
Power Three-phase 380V 50Hz
Full-load Power 25kw
Size L*W*H 3470mm*3500mm*3200mm
Weight 12000Kg
 

About Us

DCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon CarbideDCX1000 Diamond Wire Sawing Machine for Large Size Silicon Carbide

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
    
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier