| Customization: | Available |
|---|---|
| After-sales Service: | on-Site Installation, Commissioning and Training |
| Warranty: | 12 Months After Acceptance |
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CX2121 Multi-wire Saw
>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Flexible Roller System
Achieve the cutting of products within 5-60mm thickness with the flexible wire winding for 3 rollers and five rollers.
>Easy Operation
Roller cutting system, workbench, tension system, take-up and pay-off and wire winding system are set in a plane for easy operation.
>Optimized Pulley Design
6 pulleys design can reduce wire breakage rate and achieve convenient wire winding.
>Flexible Cutting
The left and right slide table on the workbench can be independently moved back and forth, and the left and right sides can cut products of different thicknesses.
>Convenient Insttallation and Removal
The rollers are fastened with screws and equipped with special electric wrench for convenient disassembling and installation.
>Swing Cutting Function
Adding swing function to workbench to achieve the opening square cutting of semiconductor silicon carbide.
>Wire break memory system.
| Detail | Parameter |
| Model | CX2121 |
| Maximum work size | 204x210x210mm |
| Slice thickness |
5-60mm(wire winding number:≤40) |
| Workbench quantity | 2 |
| Roller out diameter *Workable width | (φ160-185mm)x210x5 |
| Wire diameter | φ0.20-φ0.37 |
|
Wire spool storage |
20km(φ0.25mm) |
| Maximum running speed | 1200m/min |
| Travel of worktable lifting | 240mm |
| Travel of worktable translation | 100mm |
|
Worktable swing angel |
0 |
| Cutting method | Vertically upward movement |
|
Cutting feed speed |
0.1~99.9mm/min |
|
Cutting fluid |
Water-based cutting fluid or cutting oil |
| Fluid storage | 800L |
|
Fluid flow rate |
200L/min |
| Power supply | 380V±10% 50HZ |
| Power | 22Kw |
| Size L*W*H | 2200x1900x2400mm |
| Weight | 3000kg |
1. What Materials Could The Multi-Wire Saws Cut?
Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. What's The Size Range Of The Cut Product?
The maximum diameter of the cut material is up to 1000mm.
The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
±10μm. It's subject to the cut material, please consult us for actual data.
4. Which Countries The Equipments Have Been Exported To?
The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.
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